AMD has recently expanded its line of processors with the introduction of the new flagship mobile chip Ryzen AI 9 HX 375, a part of the Strix family. The key improvement in the HX 375 compared to its predecessor, Ryzen AI 9 HX 370, is the enhanced performance of the neural calculation unit (NPU).
The NPU computing power of the Ryzen AI 9 HX 375 reaches 55 TOPS (trillions per second), outperforming the Ryzen AI 9 HX 370 with 50 TOPS. When compared to competitors, Intel’s NPU Lunar Lake achieves 48 TOPS, and Qalcomm Snapdragon X Elite reaches 45 TOPS.
Some of the main characteristics of the Ryzen AI 9 HX 375 include:
- Integrated AMD Radeon 890M graphics system with a clock speed of 2900 MHz
- Total processor throughput of 85 TOPS when using the main CPU cores
One of the noteworthy features of the Ryzen AI 9 HX 375 is its relatively low heat generation, consuming only 28 W in standard operation. AMD also mentions that the TDP can vary between 15 to 54 watts depending on the workload configuration.
The Ryzen AI 9 HX 375 is a 12-core CPU with 4 cores utilizing Zen 5 technology and the remaining 8 cores based on mobile Zen 5C architecture. An interesting aspect is the presence of two threads even on Zen 5C cores, setting it apart from competitors with single-threaded small cores.
With a base frequency of 2 GHz per core and turbo boost up to 5.1 GHz, the AMD Ryzen AI 9 HX 375 not only offers 12 cores but also a total of 24 threads. The exact turbo boost frequencies for all cores will be revealed after independent testing, but it is anticipated to range from 2.6 to 3.0 GHz per core under maximum TDP and energy consumption.
Other noteworthy features of the Ryzen AI 9 HX 375 include support for modern extensions like AES, AMD-V, AVX, AVX2, AVX512, a maximum operating temperature of 100 °C,