In an effort to revolutionize the world of technology by creating more compact and energy-efficient devices, researchers are currently focused on integrating energy storage systems directly into microchips. This innovative approach aims to minimize energy losses during transmission between components. A team of researchers at the Lawrence Laboratory at Berkeley and the University of California in Berkeley have developed “microcapacitors” to address this challenge.
These microcapacitors are crafted from thin films of oxide hafnium and zirconium oxide, utilizing materials and production methods already familiar in the chip manufacturing process. What sets these new microcapacitors apart is their ability to accumulate significantly more energy, made possible through the use of materials with a negative capacity.
Capacitors are essential components of electrical circuits, storing energy in an electric field between two metal plates separated by a dielectric. They offer rapid energy release and longer usage lifespan compared to batteries. However, traditional capacitors have been limited by their low energy density, hindering their application in high-power devices.
To overcome these limitations, researchers developed thin films of HFO2-ZRO2 exhibiting a negative capacity effect. Through meticulous composition optimization, they achieved material light polarization even with a minimal electric field. By incorporating atomic thin layers of aluminum oxide into multiple layers of HFO2-ZRO2, the team effectively increased film thickness to 100 nm while preserving desired properties.
By integrating these films into three-dimensional microcapacitor structures, the researchers achieved record-breaking results: with energy density nine times higher and 170 times greater than the best electrostatic capacitors. These advancements pave the way for miniaturizing energy storage systems in micro devices like those found in the Internet of Things (IoT), peripheral computing systems, and artificial intelligence processors.
The team’s next endeavor involves scaling up the technology and integrating it into fully-fledged microchips, with a focus on enhancing the negative capacity of the films. This continued effort holds great promise for the future of energy-efficient and compact electronic devices.