Supersia Chip Enables Wall and Cardboard Vision

Researchers have developed a revolutionary technology that allows users to see inside objects without the use of harmful X-ray radiation. A tiny chip that can be integrated into a smartphone has the ability to capture images of objects through materials like cardboard and other opaque substances. This advancement brings us closer to the realm of “X-ray vision” akin to Superman’s superhuman abilities.

Inspired by the comics depicting a man of steel, scientists from Texas University in Dallas and Seoul National University collaborated to create a unique visualization system. Through the use of the microchip and specialized data processing algorithms, the technology enables individuals to virtually peer inside packages and even walls without causing any harm.

“This technology is reminiscent of Superman’s X-ray vision,” stated UTD electrical engineering professor and Texas Center for Analogue Perfection (TXACE) director Kenneth O. He clarified that the signals utilized are in the 200 to 400 gigahertz range, rather than potentially harmful X-rays.

The technology was developed over years of research and collaboration between the team, emitting radiation in the terahertz (THz) range. These electromagnetic waves, with frequencies ranging from 0.1 to 10 THz, are invisible to the naked eye and considered safe. In 2022, it was demonstrated that rays at 430 GHz emitted by a microchip could penetrate fog, dust, and other obstacles that obstruct optical light. The waves reflected off objects and returned to the microchip, where pixels captured the signals to generate an image.

Utilizing complementary metal-oxide-semiconductor (CMOS) technology commonly found in modern consumer processors and digital devices, the researchers created a cost-effective means to produce and detect terahertz signals, particularly at frequencies above 200 GHz. This enhancement led to significantly improved image resolution in the 2022 model. The new chip, comprising a 1×3 CMOS pixel matrix operating at 296 GHz, was a compact and fully integrated solution.

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