announced About forming a consortium ucie (Universal Chiplet Interconnect Express) aimed at the development of open specifications and the formation of an ecosystem for technology chiplings (Chiplet). The chippers allow you to create combined hybrid integrated circuits (multimele modules) formed from independent semiconductor blocks that are not tied to one manufacturer and interacting with each other using the standard high-speed UCIE interface.
To develop a specialized solution, for example, creating a processor with a built-in accelerator for machine learning or networking operations, when using UCI, it suffices to use already existing chipsets with processor nuclei or accelerators offered by different manufacturers. If typical solutions are absent, you can create your own chiplet with the necessary functionality, applying convenient technologies and solutions.
After that, it is enough to combine selected chips using a block layout in the LEGO designer style (the proposed technology something resembles the use of PCIE boards for laying a computer fillings, but only at the level of integrated circuits). Data exchange and interaction between the chiplots is carried out using a high-speed UCIE interface, and the “System” system in the case “(SOC, SOC, System-On-Chip) system (SOC, SYSTEM-ON-CHIP) is used to lay out blocks. / P>
Compared to SOC, chiplet technology makes it possible to create replaceable and reused semiconductor blocks that can be used in different devices, which significantly reduces the cost of developing chips. In systems on the basis of chiplots, various architectures and production technological processions can be combined – as each chiplet operates separately, interacting through standard interfaces, in one product can
Combine blocks with different command set architectures (ISA), such as RISC-V, ARM and X86. The use of chiplots also simplifies testing – each chiplet can be tested separately at the stage before integration into the finished solution.
Intel, AMD, ARM, Qualcomm, Samsung, ASE, ARM, Qualcomm, Samsung, Ase (Advanced Semiconductor Engineering), Google Cloud, Meta / Facebook, Microsoft and Taiwan Semiconductor Manufacturing Company. The public is presented with an open specification UCIE 1.0